Picture of Developer track Convac
Current status:
AVAILABLE
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Description:

Photoresist developing track for silicon and quartz wafers

Key Features and Accessories:

Temperature controlled developer line. Wafer front- and backside rinsing with DIW. Two process chambers for developing. Wafer front- and backside rinsing with DIW. Two hot-plates at 110 C, one hot-plate at 22C temperature. Cassette to cassette wafer handling. Recipes: 1) development and bake 2) development only 3) bake only

Key Specifications:

AZ726 MIF developer in temperature controlled line. Hot-plate temperature 110 C.

Substrate Size:

150 mm

Allowed Materials:

Silicon and quartz wafers. IC-compatible metals.

Forbidden Materials:

Non-IC materials. Double side resist coated wafers not allowed due to likely particle contamination.

Availability and Cost:

Availability: F
Cost: moderate

Tool name:
Developer track Convac
Area/room:
M1 A Lithography
Category:
Lithography
Manufacturer:
Convac
Model:
M6000

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Licensed Users

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