Optical aligner with backside alignment capability. Ultraviolet nano-imprint lithography (UV-NIL) option installed.
Key Features and Accessories:
Front or backside alignment, proximity (fully non-contact) / soft / hard / vacuum contact modes and flood exposure. Wet resist processing possible (with special authorization). Nano-imprint lithography (NIL) with full alignment capability. Enhanced image processing for alignment. Bond aligner option available from manufacturer. Installed on anti-vibration base.
||50 mm / 100 mm (150 mm available from manufacturer)
||Smaller samples on carrier wafer
||5-inch (other sizes available from manufacturer)
||Proximity (fully non-contact), soft contact, hard contact, vacuum contact, flood exp
||Approx 1 micron
||365 nm (broadband)
50 mm / 100 mm
All cleanroom compatible wafers
All non-cleanroom-compatible materials