Picture of Mask aligner - Mauri Antero
Current status:
AVAILABLE
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Optical aligner with backside alignment capability. Ultraviolet nano-imprint lithography (UV-NIL) option installed.

Key Features and Accessories:

Front or backside alignment, proximity (fully non-contact) / soft / hard / vacuum contact modes and flood exposure. Wet resist processing possible (with special authorization). Nano-imprint lithography (NIL) with full alignment capability. Enhanced image processing for alignment. Bond aligner option available from manufacturer. Installed on anti-vibration base.

Key Specifications:

Substrate size 50 mm / 100 mm (150 mm available from manufacturer)
  Smaller samples on carrier wafer
Photomask size 5-inch (other sizes available from manufacturer)
Contact modes Proximity (fully non-contact), soft contact, hard contact, vacuum contact, flood exp
Minimum linewidth Approx 1 micron
Exposure wavelength 365 nm (broadband)

Substrate Size:

50 mm / 100 mm

Allowed Materials:

All cleanroom compatible wafers

Forbidden Materials:

All non-cleanroom-compatible materials

Tool name:
Mask aligner - Mauri Antero
Area/room:
M2 F8 Lithography
Category:
Lithography
Manufacturer:
Süss
Model:
MA-6

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