Description:

Photoresist coating equipment for silicon and quartz wafers.

Key Features and Accessories:

Option for automated resist dispense and EBR. Max. substrate size 150 mm. 

Key Specifications:

Spin speed up to 6000 RPM. Controller for 10 recipes with 24 steps in each.

Substrate Size:

150 mm

Allowed Materials:

Silicon and quartz wafers. IC-compatible metals.

Forbidden Materials:

Non-IC materials

Availability and Cost:

Availability: F
Cost: High