Production mask aligner for optical lithography
Key Features and Accessories:
Cassette to cassette wafer handling. Hard / soft / proximity / non-contact / flood exposure modes. Manual and automatic backside alignment capability.
Minimum linewidth approximately 1.5 µm. 1000 W broadband UV mercury short arc lamp (365 nm).
Silicon, quartz wafers if coated with opaque materials
Double side resist coated wafers not allowed due to likely particle contamination
Availability and Cost:
Availability class: F
Cost categogy: High