Description:

Production mask aligner for optical lithography

Key Features and Accessories:

Cassette to cassette wafer handling. Hard / soft / proximity / non-contact / flood exposure modes. Manual and automatic backside alignment capability. 

Key Specifications:

Minimum linewidth approximately 1.5 µm. 1000 W broadband UV mercury short arc lamp (365 nm).

Substrate Size:

150 mm

Allowed Materials:

Silicon, quartz wafers if coated with opaque materials

Forbidden Materials:

Double side resist coated wafers not allowed due to likely particle contamination

Availability and Cost:

Availability class: F
Cost categogy: High