Manual contact aligner with front-side and back-side alignment for up to 6” wafers. Tooling exists for 4” wafers (with 5”x5” photomasks), 6” wafers (with 7”x7” photomasks), and also for 8” wafers (with 9”x9” photomasks), but the exposed area is limited to a circle with a diameter of 165 mm). Tooling also exists for exposing discrete chips with 4”x4” photomasks. 5” wafers have been exposed with 6” hardware. Nominal resolution (with vacuum contact) is 0.6 µm.