Picture of PECVD Oxford Plasmalab100
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PECVD Plasmalab 100 is used to deposit thin films. Plasma-enhanced Chemical Vapour Deposition process silicon dioxide and silicon nitride films at low temperatures (~300 °C).

Tool name:
PECVD Oxford Plasmalab100
Area/room:
M2 F4 Plasma and Sputtering
Category:
CVD & ALD
Manufacturer:
Oxford
Model:
Plasmalab100

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