Ovens for photoresist baking during litography processes.
Key Features and Accessories:
Chamber size 400x400x330 mm.
A12, Resist Oven 1, "soft bake", is kept permanently at 90°C. A13, Resist Oven 2, "post bake", temperature adjustable between 110-120°C. A14, Resist Oven 3, "hard bake", temperature adjustable from 140°C up to 250°C.
100 mm or 150 mm dia
Subsrates: silicon, quartz. Layers: IC-compatible metals
Non IC-compatible materials
Availability and Cost: