Fully automatic cassette-to-cassette coater and developer. Wafer sizes: 4” (coating only), 6”, and 8”. Duplicate ovens/hot plates, priming module, and robot arm for IC clean and non-IC clean wafers. Two pumps & resist lines for thin photoresists, and one for a thick photoresist. Only one developer available. Puddle & spray modes available in developer (spray mode ‘wastes’ developer, so use it only sparingly).