Description:

Photoresist coating system for silicon and quartz wafers

Key Features and Accessories:

Two process chambers with two resist lines going to each. SPR700 and AZ9235 positive photoresists in resist lines. EBR and backside wash capability. Temperature controlled developer line. Hot-plate soft baking at 90 °C. Cassette to cassette wafer handling. 

Key Specifications:

Positive photoresists: SPR700, AZ9235. Thicknesses from 1.1 µm to 6.3 µm with single coating depending on the resist. AZ726 MIF developer. EBR solvent NBA.

Substrate Size:

150 mm

Allowed Materials:

Silicon and quartz wafers. IC-compatible metals.

Forbidden Materials:

Non-IC materials. Double side resist coated wafers not allowed due to likely particle contamination.

Availability and Cost:

Availability: O
Cost: Special