Picture of Silicon ICP etcher (Aviza)
Current status:
AVAILABLE
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The tool is designed for deep silicon etching based on Bosch process. Available wafer sizes are 150 mm and 200 mm. Etch rate may exceed 10 µm/min, selectivities to mask materials range from 10 to 10 000, aspect ratios reached depend on feature geometry and size. Uniformities below 5 % (or even below 2 %) can be achieved, depending on other process requirements.

Tool name:
Silicon ICP etcher (Aviza)
Area/room:
M1 B Plasma Etching
Category:
Dry etching
Manufacturer:
Aviza
Model:
Omega i2l

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