Picture of ICP-RIE Plasmalab 100
Current status:
AVAILABLE
Book | Log
Show/Collapse all

1st Responsible:
2nd Responsible:
Process:
You must be logged in to view files.

http://micronova.fi/nanofab/equipment/dryetching/icplasmaecher.html

Description:

Inductively coupled plasma etcher for etching silicon, compound semiconductors and polymers.

Key Features and Accessories:

Two power sources: ICP source 2kW, CCP source 300W. Available etch gases: BCl3, Cl2, CHF3 (SiCl4 formerly), SF6, H2 and O2/N2/Ar. Operating temperature from -150 °C to +400 °C.

Key Specifications:

• Silicon etch rate up to 8 µm/min possible. Typically 2-3 µm/min. 
• Typical etch rate for GaN 350 nm/min (some have 600 nm/min) 
• Typical etch rate for GaAs 2 µm/min 
• Typical etch rate for InP 2 µm/min

Substrate Size:

100 mm wafer. Smaller samples can be glued on top of a 100 mm dummy wafer. (Carrier wafer is recommended to have involatile masking layer i.e. Al2O3 for flourine chemstries). Check the provided document about thermal contact to carrier wafer. The following link to a wiki of some provincial university also has good explanations on thermal contact between sample and carrier : https://snf.stanford.edu/SNF/equipment/dry-etching/general-information-on-plasma-etching/how-to-attach-samples-to-carrier-wafers-for-plasma-etching-or-deposition

 

Allowed Materials:

Si, GaN, InP, GaAs, photoresists, Al, Cr, Ge, Ti, Glasses (ask the main user)

Forbidden Materials:

Noble metals (Au, Ag, Pt, Cu, Pd), Heavy metals (Cd, Pb, Zn), silicones

Tool name:
ICP-RIE Plasmalab 100
Area/room:
M2 F9 ALD
Category:
Dry etching
Manufacturer:
Oxford Instruments
Model:
Oxford Instruments Plasmalab System100 - ICP 180

Instructors

Licensed Users

You must be logged in to view tool modes.