The grinder is used for thinning of silicon and quartz glass wafers. Acceptable wafer sizes are 100, 125, 150 and 200 mm. The wafers can be ground at the same time. The tool has two grinding wheels. The one is used as course wheel and the other fine wheel.
There exists grinding wheels for silicon and quartz glass material. Typically course wheel removes most of the material and the fine wheel removes the damage induced by course wheel and finishes the wafer shape and the surface appearance. The material removal rate is typically 1-8 µm/s during course grinding and 1.2-0.2 µm/s during fine grinding. The total thickness variation of the wafer is typically less than 1 µm after grinding.