Picture of Wafer bonder EVG5201S
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Wafer bonding tool for 4-8’’ wafers. Bond atmosphere air or vacuum (1e-3mbar). Possibility to apply 3500N pressure. Upgradeable to enable wafer heating and anodic bonding.

Tool name:
Wafer bonder EVG5201S
Area/room:
M1 J Wafer Bonding
Category:
Wafer Bonding
Manufacturer:
Electronic Vision
Model:
EVG5201S

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