Picture of Electrochemical Etching Cell
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AVAILABLE
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Equipment for porous silicon formation by electrochemical etching of silicon. 100, 150, and 200 mm wafers can be processed using a different wafer holder. 150 mm SOI wafers can be used - holder with top contacts.

Both solid and wet-back contact configuration.

IC-compatible process (no metal contamination).

Etching current and voltage profile can be design using computer interface.

Max. current is 32 A.

Tool name:
Electrochemical Etching Cell
Area/room:
M1 C Wet Processes
Category:
Wet Processes
Manufacturer:
AMMT
Model:
MPSB200

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