Picture of Wet Bench Oxide Etch
Current status:
AVAILABLE
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1st Responsible:
2nd Responsible:
Process:
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Approved materials : Silicon wafers and chips

Forbidden materials : Metals

Tool name:
Wet Bench Oxide Etch
Area/room:
M2 F8 Lithography
Category:
Wet Processes
Manufacturer:
Stangl
Model:
nn

Approved use : Wet etching of Silicon dioxide using buffered HF

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