Picture of Sputter Plasmalab F10
Current status:
DOWN
Book | Log
Show/Collapse all

1st Responsible:
2nd Responsible:
Process:
You must be logged in to view files.

Sputter deposition by physical vapor deposition (PVD) of Al, Cu, Cr, Ti, Pt, W.

Key Features and Accessories:

Water cooled substrate holder, deposition in rotating or static mode, vacuum loadlock for one wafer.

Substrate Size:

Only 100 mm

Allowed Materials:

Si, SiO2, Si3N4, metals, photoresists, semiconductors and glasses (ask main user).

Forbidden Materials:

Sticky, powder and liquid materials.

License and training!!!

The tool training is given on the 4-th Tuesday of every month, at 10:00. Contact a main user to confirm your participation.

Tool name:
Sputter Plasmalab F10
Area/room:
M2 F10 Plasma
Category:
Sputtering
Manufacturer:
Oxford Instruments
Model:
Plasmalab 400, Oxford Instruments

Instructors

Licensed Users

You must be logged in to view tool modes.