This is a dry inspection tool capable for wafer mapping. Target applications include bonding quality quick evaluation, released MEMS structure inspection, alignment check. (Note: for bonding quality, it is better to perform complementary check by SAM.) Using a Point & Click operation the stage is automatically moved to a point of interest.
There are two magnifications (i.e. two lens), namely low and high. IR light can illustrate from the top or the bottom of the wafer.
The wafer chuck is considered to be non-IC compatible. If IC clean wafer is in use, it needs to be isolated from the chuck.