Picture of Laser Wafer Marker
Current status:
AVAILABLE
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Used for marking and cutting of silicon wafers. Cutting works best for thin <250 µm thick wafers.

Currently other materials than silicon are not allowed.

No metals allowed

Tool name:
Laser Wafer Marker
Area/room:
Lab 1019 Thin Film
Category:
Other processes
Manufacturer:
Cencorp
Model:
300 LM

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