Picture of Fume Hood Electroplating
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Process:
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Use: Electroplating of Cu, Sn and Ni

Allowed seed - layer metallization : Cu, Au, Pt & Pd 


 
 

Tool name:
Fume Hood Electroplating
Area/room:
Lab 1019 Thin Film
Category:
Wet Processes
Manufacturer:
NB Technologies
Model:
NN

Allowed seed-layer metallization: Cu, Au, Pt & Pd.

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