Picture of Wafer Bonder AML
Current status:
AVAILABLE
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Anodic and thermocompression bonding, thermal embossing
20-560C, 2.5kV

 

 

 

Tool name:
Wafer Bonder AML
Area/room:
M2 F11 Wafers
Category:
Wafer Bonding
Manufacturer:
AML
Model:
AML-AWB

Use: 
• Anodic bonding
• Thermocompression bonding
• Thermal embossing
 
Specifications:
• Only for 100 mm wafers
• Temperature range: 20 °C … 560 °C
• Max anodic bonding voltage 2.5 kV
• Max vacuum ~10−6 mbar
• Max compression 15 kN (200 N with graphite top platen)
 

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