Picture of Alignment verification system DSM8
Current status:
AVAILABLE
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Equipment for checking accuracy of double-sided alignment for IC clean and non-IC clean wafers. Measurement accuracy 0.5 µm.

Allowed materials:

IC clean 50 mm to 200 mm metal and non-metal wafers, wafer thickness <10mm,

Non-IC clean 150 mm and 200 mm wafers with separate chuck

Tool name:
Alignment verification system DSM8
Area/room:
M1 J Wafer Bonding
Category:
Characterization
Manufacturer:
Süss Microtech
Model:
DSM8

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