Picture of Bond aligner EVG620
Current status:
AVAILABLE
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2nd Responsible:
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Description:

The tool is designed for alignment of wafers prior to bonding in EVG 520 wafer bonder. Also tooling for mechanical mask alignment.

Key Features and Accessories:

Optical alignment mark locations: X = ± 40 mm from wafer centre Y = 0 mm from centreline (contact engineer in charge for details).

Key Specifications:

Alignment accuracy after wafer bonding < 10 µm.

Substrate Size:

100 mm and 150 mm

Allowed Materials:

IC-compatible chuck for 150 mm wafers. Non-IC compatible chucks for 150 mm and 100 mm wafers.

Forbidden Materials:

Other except allowed materials.

Availability and Cost:

Availability: O
Cost: High

Tool name:
Bond aligner EVG620
Area/room:
M1 J Wafer Bonding
Category:
Wafer Bonding
Manufacturer:
Electronic Vision
Model:
EVG620

Instructors

Licensed Users

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