The tool is designed for alignment of wafers prior to bonding in EVG 520 wafer bonder. Also tooling for mechanical mask alignment.
Key Features and Accessories:
Optical alignment mark locations: X = ± 40 mm from wafer centre Y = 0 mm from centreline (contact engineer in charge for details).
Alignment accuracy after wafer bonding < 10 µm.
100 mm and 150 mm
IC-compatible chuck for 150 mm wafers. Non-IC compatible chucks for 150 mm and 100 mm wafers.
Other except allowed materials.
Availability and Cost: