Optical aligner with backside alignment capability. Ultraviolet nano-imprint lithography (UV-NIL) option installed.
Key Features and Accessories:
Front or backside alignment, proximity (fully non-contact) / soft / hard / vacuum contact modes and flood exposure. Wet resist processing possible (with special authorization). Nano-imprint lithography (NIL) with full alignment capability. Enhanced image processing for alignment. Bond aligner option available from manufacturer. Installed on anti-vibration base.
Key Specifications:
| Substrate size |
50 mm / 100 mm / 150 mm |
| |
Smaller samples on carrier wafer |
| Photomask size |
5-inch, 7-inch (other sizes available from manufacturer) |
| Contact modes |
Proximity (fully non-contact), soft contact, hard contact, vacuum contact, flood exp |
| Minimum linewidth |
Approx 1 micron |
| Exposure wavelength |
365 nm (broadband) |
Substrate Size:
50 mm / 100 mm / 150 mm
Allowed Materials:
All cleanroom compatible wafers
Forbidden Materials:
All non-cleanroom-compatible materials