|
View
| CVD Furnace | 2L1020 10 | Furnace Processes | MTI Corporation | OTF-1200X | Optoelectronics Group |
|
View
| Mechanical testing system MTS | 2L1155 01 | Characterization | MTS | NN | Electronics Integration and Reliability |
|
View
| 240 LED lamp | 2L4197 01 | Characterization | Cree | Cree Edge High Output | Electron Physics Group |
|
View
| 2D Heterostructure Transfer System | 2F13 18 | Other processes | HQ Graphene | NN | Photonics Group |
|
View
| 3D printer 1 | 2L4142 14 | Other processes | Lulzbot | TAZ6 | Aalto Nanofab |
|
View
| 3D printer 2 | 2L4142 15 | Other processes | Lulzbot | TAZ6 | Aalto Nanofab |
|
View
| 3D printer 3 | 2L4142 16 | Other processes | Lulzbot | TAZ6 | Aalto Nanofab |
|
View
| AFM Dimension Icon | 2L4168 03 | Characterization | Bruker | Dimension Icon | Aalto Nanofab |
|
View
| AFM Jupiter XR | 1F13 22 | Characterization | Oxford Instruments | Jupiter XR | VTT Nanofabrication Centre |
|
View
| AFM NT-MDT Ntegra | 2L1020 13 | Characterization | Ntegra | NT-MDT Ntegra AFM | Aalto Nanofab |
|
View
| Aiolos Probing Station | 1F13B 08 | Characterization | Afore | A | VTT Nanofabrication Centre |
|
View
| ALD Reactor ALD-2 | 2F09 09 | CVD & ALD | Beneq | Beneq TFS-500 | Aalto Nanofab |
|
View
| ALD Reactor ALD-3 | 2F09 07 | CVD & ALD | Picosun | SUNALE R-200 Advanced | Aalto Nanofab |
|
View
| ALD Reactor ALD-4 | 2F09 14 | CVD & ALD | Beneq | TFS 500 | Aalto Nanofab |
|
View
| ALD Reactor Veeco | 1F04 14 | CVD & ALD | Veeco | Fiji XT | VTT Nanofabrication Centre |
|
View
| Alignment verification system DSM8 | 1G 37 | Characterization | Süss Microtech | DSM8 | Microelectronic Systems |
|
View
| AlN Sputtering System | 1E 04 | Sputtering | AMS | SMT2004 | Microelectronic Systems |
|
View
| Aluminium Etch | 2F12 26 | Wet Processes | PM Plast | NN | Aalto Nanofab |
|
View
| Annealing | 2F07 04A | Annealing | Centrotherm | Centrotherm | Aalto Nanofab |
|
View
| Annealing furnace PEO-603 | 1F04 13 | Annealing | ATV | PEO-603 | Microelectronic Systems |
|
View
| Anodization Cell | 1H05 02 | Other processes | Protoshop | . | Microelectronic Systems |
|
View
| ASM LPCVD Nitride | 1D 21-1 | CVD & ALD | ASM | DUO A400 | VTT Nanofabrication Centre |
|
View
| ASM LPCVD Poly | 1D 22-1 | CVD & ALD | ASM | DUO A400 | VTT Nanofabrication Centre |
|
View
| ASM LPCVD TEOS | 1D 21-2 | CVD & ALD | ASM | DUO A400 | VTT Nanofabrication Centre |
|
View
| ATV furnace Mörkö | 2F10 16 | Furnace Processes | ATV | PEO-604 | Microfabrication Group |
|
View
| Au plating module | 1F05 06 | Electrochemical Deposition | PM Plast | Au | Microelectronic Systems |
|
View
| Backgrinder DFG8540 | 1STB 01 | Back-end Processes | Disco corporation | DFG8540 | BA62 |
|
View
| Beamer Workstation Linux | 2F03 04 | Lithography | Dell | Precision T5820 | Aalto Nanofab |
|
View
| Beamer Workstation Windows | 2F03 03 | Lithography | Dell | Precision T5820 | Aalto Nanofab |
|
View
| Black Magic | 2L1018 04 | Epitaxial Growth | NN | NN | Optoelectronics Group |
|
View
| Bond Aligner EVG 610 | 1G 36 | Wafer Bonding | EVG | EVG 610 | Microelectronic Systems |
|
View
| Bond aligner EVG620 | 1E 17 | Wafer Bonding | Electronic Vision | EVG620 | Microelectronic Systems |
|
View
| CD MT3000 | 1A 24 | Characterization | MueTec | MT3000 | VTT Nanofabrication Centre |
|
View
| CMP 6DSSP | 1ST 04 | Back-end Processes | Strasbaugh | 6DSSP | Microelectronic Systems |
|
View
| Coater Developer EVG120 | 1A 25 | Lithography | EVG | EVG120 | Microelectronic Systems |
|
View
| Contact Angle Meter THETA | 2F13 10 | Characterization | Biolin Scientifics | nn | Aalto Nanofab |
|
View
| Cryogenic Storage | 1OC 07 | Lithography | VTT | Thermal Container | Microelectronic Systems |
|
View
| Current in-plane tunneling prober (CIPT) | 1F06 16 | Characterization | Bruker | SmartProber-TT | Advanced Manufacturing and Materials (AM2) |
|
View
| Defect inspection system 8420 Candela | 1E 25 | Characterization | KLA-Tencor | Candela 8420 | Microsystems and nanoelectronics |
|
View
| Developer Spinner LabSpin | 2F08 28 | Lithography | Süss | LabSpin6 | Aalto Nanofab |
|
View
| Developer track Convac | 1A 03 | Lithography | Convac | M6000 | Microelectronic Systems |
|
View
| Dicing Saw DFD6341 | 1MP 19 | Back-end Processes | Disco | DFD6341 | Microelectronic Systems |
|
View
| Dicing saw Disco | 1MP 01 | Back-end Processes | Disco | DFD651 | Microelectronic Systems |
|
View
| Die Sorter IC 1200 | 1MP 18 | Other processes | Infotech | IC 1200 | VTT Nanofabrication Centre |
|
View
| Diffusion furnace T1 Oxidation | 1D 27-1 | Furnace Processes | Tempress | TS8604LH | BA62 |
|
View
| Diffusion furnace T2 Oxidation | 1D 27-2 | Furnace Processes | Tempress | TS8604LH | BA62 |
|
View
| Diffusion furnace T3 Oxidation | 1D 27-3 | Furnace Processes | Tempress | TS8604LH | BA62 |
|
View
| Diffusion furnace T4 Anneal | 1D 27-4 | Furnace Processes | Tempress | TS8604LH | BA62 |
|
View
| Diffusion furnace, A1 anneal | 1D 01_A1 | Furnace Processes | Centrotherm | E1200 HT 260-4 | Microelectronic Systems |
|
View
| Diffusion furnace, A2 oxidation | 1D 01_A2 | Furnace Processes | Centrotherm | E1200 HT 260-4 | Microelectronic Systems |
|
View
| Diffusion furnace, A3 oxidation | 1D 01_A3 | Furnace Processes | Centrotherm | E1200 HT 260-4 | Microelectronic Systems |
|
View
| Diffusion furnace, A4 oxidation | 1D 01_A4 | Furnace Processes | Centrotherm | E1200 HT 260-4 | Microelectronic Systems |
|
View
| Disco DADdy - Dicing saw | 2L1019 41 | Back-end Processes | Disco | DAD3220 | Aalto Nanofab |
|
View
| DLTS | 2L4142 06 | Characterization | Semilab | DLS-83D | Electron Physics Group |
|
View
| DRIE Rapier RP | 1B 24 | Dry etching | SPTS | Rapier RP | Microsystems and nanoelectronics |
|
View
| Dual spin rinse drier 150 mm and 200 mm | 1D 24 | Other processes | OEM | NN | VTT Nanofabrication Centre |
|
View
| Dual Spin Rinse Drier 16 and 17 | 1F05 23 | Wet Processes | Rhetech/Semitool | SRD 8300 S | Microelectronic Systems |
|
View
| Dual SRD 3 (100 mm) and 4 (150 mm) | 1C 06 | Wet Processes | Semitool | SRD 880S | Microelectronic Systems |
|
View
| Dual SRD 6 (150 mm) and 10 (200mm) | 1D 11 | Wet Processes | Semitool | SRD 880S | Microelectronic Systems |
|
View
| Dual SRD 7 (100 mm) and 8 (150 mm) | 1C 25 | Wet Processes | Rhetech/Semitool | SRD 87S61 | Microelectronic Systems |
|
View
| Dump Module | 1ST 14 | Wet Processes | PM-Plast | PM-Plast | VTT Nanofabrication Centre |
|
View
| EBL Pattern Generator | 2F13 07B | Lithography | Raith GmbH | NN | Aalto Nanofab |
|
View
| EBL Raith EBPG5200 | 2F03 02 | Lithography | Raith | EBPG5200 | Aalto Nanofab |
|
View
| EBL Vistec | 2F03 01 | Lithography | Vistec | EPBG5000pES | Aalto Nanofab |
|
View
| EBPG Emulator | 2F03 06 | Lithography | Raith | HP Z8 | Aalto Nanofab |
|
View
| Electroplating Cu | 2L1019 30 | Electrochemical Deposition | NB Technologies | NN | Aalto Nanofab |
|
View
| Electroplating Ni | 2L1019 32 | Electrochemical Deposition | NB Technologies | NN | Aalto Nanofab |
|
View
| Electroplating Sn | 2L1019 31 | Electrochemical Deposition | NB Technologies | NN | Aalto Nanofab |
|
View
| Electrostatic Carrier | 1F01 08 | Other processes | Protec | PT3000 | Microelectronic Systems |
|
View
| Ellipsometer Plasmos | 2F11 19 | Characterization | Plasmos | Plasmos SD2300 | Aalto Nanofab |
|
View
| Evaporator e-gun Edwards | 2L1019 02 | Evaporation | Edwards | Edwards E306A | Aalto Nanofab |
|
View
| Evaporator LISA | 2S09 02 | Evaporation | Instrumentti Mattila | IM-9912 | Aalto Nanofab |
|
View
| Evaporator MASA | 2S09 01 | Evaporation | MASA | IM-9912 | Aalto Nanofab |
|
View
| Evaporator Plassys | 2S10 02 | Evaporation | Plassys | MEB700S2-III UHV | Aalto Nanofab |
|
View
| Evaporator Ångström | 1F05 32 | Evaporation | Ångström Engineering | 09091 | VTT Nanofabrication Centre |
|
View
| FIB Helios SEM EDX | 2F13 04 | Nanostructuring | FEI | Helios Nanolab600 | Aalto Nanofab |
|
View
| Field emission SEM | 2L4142 10 | Characterization | JEOL | JSM-6335F | Electronic reliability and integration |
|
View
| Film stress measurement tool | 1F01 07 | Characterization | Toho Technology | FLX 2320-S | Microelectronic Systems |
|
View
| Flash Light | 2F13 16B | Characterization | Hensel | EHT 3000 Focus + TRIA 3000 S | Electron Physics Group |
|
View
| Flatness meter ADE | 1ST 03 | Characterization | ADE | 9500 Ultra Gage | Microelectronic Systems |
|
View
| Flip Chip Bonder | 1F13B 01 | Back-end Processes | Finetech | femto2 | Advanced Manufacturing and Materials (AM2) |
|
View
| Flip-chip bonder B | 1F01 04 | Back-end Processes | SET | FC150/1998 | Microelectronic Systems |
|
View
| Four Point Probe Old | 2F13 20 | Characterization | NN | NN | Aalto Nanofab |
|
View
| Four-point Probe Loresta | 1F13B 10 | Characterization | Mitsubishi Petrochemical Co., Ltd | Loresta AP MCP-T400 | Microelectronic Systems |
|
View
| Fume Hood HF etch | 2F12 20 | Wet Processes | PMPlast | 1900-710 | Aalto Nanofab |
|
View
| Fume hood Metal etch | 2F12 12 | Wet Processes | PMPlast | NN | Aalto Nanofab |
|
View
| Fume Hood TMAH | 2F12 10 | Wet Processes | PMPlast | NN | Aalto Nanofab |
|
View
| Fume Hood A | 2F07 02 | Wet Processes | PMplast | PMPlast | Electron Physics Group |
|
View
| Fume Hood Acid work | 2L1019 36 | Wet Processes | Visu | Aalto | Aalto Nanofab |
|
View
| Fume Hood Acid work 1 | 2F12 16 | Wet Processes | PMPlast | NN | Aalto Nanofab |
|
View
| Fume Hood Acid work 2 | 2F12 19 | Wet Processes | PMPlast | Acids | Aalto Nanofab |
|
View
| Fume Hood ALD | 2F09 01 | Wet Processes | PMPlast | PMPlast | Aalto Nanofab |
|
View
| Fume Hood Cu Contamination | 2F11 09 | Wet Processes | PMPlast | Spinner | Aalto Nanofab |
|
View
| Fume Hood EBL Solvents | 2F03 08 | Lithography | Muovikopla | NN | Aalto Nanofab |
|
View
| Fume Hood EBL Spinner | 2F03 09 | Lithography | Muovikopla | NN | Aalto Nanofab |
|
View
| Fume Hood Electroplating | 2L1019 33 | Wet Processes | NB Technologies | NN | Aalto Nanofab |
|
View
| Fume Hood KOH | 2L1019 37 | Wet Processes | Visu | Aalto | Aalto Nanofab |
|
View
| Fume Hood Lift off | 2F12 18 | Wet Processes | PM Plast | Type no 2580-1 | Aalto Nanofab |
|
View
| Fume Hood Lithography | 2L1019 34 | Wet Processes | Visu | Aalto | Aalto Nanofab |
|
View
| Fume Hood Salo | 2EC 11 | Wet Processes | Kojair | NN | Aalto Nanofab |
|
View
| Fume Hood Solvents | 2F12 05 | Wet Processes | PMPlast | Fume Hood | Aalto Nanofab |
|
View
| Fume Hood Solvents | 2L1019 35 | Wet Processes | Visu | Aalto | Aalto Nanofab |
|
View
| Fume Hood Spinner | 2S11 01 | Lithography | PMPlast | Photoresist | Aalto Nanofab |
|
View
| Fumehood | 1TF 03 | Wet Processes | . | . | Microelectronic Systems |
|
View
| Fumehood | 1TF 04 | Wet Processes | . | . | Microelectronic Systems |
|
View
| Fumehood ACID | 1C 21 | Wet Processes | Lotus | . | Microelectronic Systems |
|
View
| Fumehood BOAT CLEAN | 1C 22 | Wet Processes | Lotus | Boat Clean | Microelectronic Systems |
|
View
| Fumehood DEVELOP | 1A 21 | Wet Processes | Lotus | - | Microelectronic Systems |
|
View
| Fumehood for anodization | 1H05 03 | Wet Processes | . | . | Microelectronic Systems |
|
View
| Fumehood KULTA | 1F05 16 | Wet Processes | Semitool | . | Microelectronic Systems |
|
View
| Fumehood LIFT-OFF | 1WC 03 | Wet Processes | Stangl | . | Microelectronic Systems |
|
View
| Fumehood Litho | 1F03 16 | Lithography | Lotus | - | Microelectronic Systems |
|
View
| Fumehood MASK CLEAN | 1C 09 | Wet Processes | Lotus | . | Microelectronic Systems |
|
View
| Fumehood PLATING | 1F05 22 | Electrochemical Deposition | Lotus | . | Microelectronic Systems |
|
View
| Fumehood Polymers | 1G 30 | Wet Processes | Lotus | NN | VTT Nanofabrication Centre |
|
View
| Fumehood SCALE&CUT | 1S01 01 | Wet Processes | Amsel | . | Microelectronic Systems |
|
View
| Fumehood SERVICE ACIDS | 1WC 01 | Wet Processes | Amsel | . | Microelectronic Systems |
|
View
| Fumehood SERVICE SOLVENTS | 1WC 02 | Wet Processes | PMPlast | . | Microelectronic Systems |
|
View
| Fumehood solvents for cleaning parts | 1H06 01 | Wet Processes | PM Plast | . | Microelectronic Systems |
|
View
| Fumehood TMAH | 1C 17 | Wet Processes | Lotus | . | Microelectronic Systems |
|
View
| Fumehood VESSEL | 1F02 05 | Wet Processes | Stangl | . | Microelectronic Systems |
|
View
| Fumehood WET SERVICE | 1H04 02 | Wet Processes | Lotus | WS | Microelectronic Systems |
|
View
| Furnace MiniBrute Lower | 2L1020 02B | Furnace Processes | Thermco | MiniBrute | Physical Characteristics of Surfaces and Interface |
|
View
| Furnace MiniBrute Upper | 2L1020 02A | Furnace Processes | Mini-Brute | Mini-Brute | Aalto Nanofab |
|
View
| Furnace PEO | 2F12 08 | Furnace Processes | PEO | PEO-601/ATV | Aalto Nanofab |
|
View
| Glovebox ALD Precursors | 2EC 04 | CVD & ALD | Innovative Technology | PureLab HE 21 | Aalto Nanofab |
|
View
| Goniometer | 1A 16 | Characterization | Unknown | Unknown | Microelectronic Systems |
|
View
| Hall Measurement System Ecopia | 2L4166 02 | Characterization | Ecopia | HMS500 | Optoelectronics Group |
|
View
| Halogen lamp | 2L4196 05 | Characterization | OSRAM | AluPAR 64 NSP | Electron Physics Group |
|
View
| Heating Bath IKA | 2F12 22 | Wet Processes | IKA | HBR 4 | Aalto Nanofab |
|
View
| He-Cd 325 nm Fluorescence Spectroscopy | 2L4166 03 | Characterization | NN | NN | Advanced Manufacturing and Materials (AM2) |
|
View
| HF vapor etcher MEMS-CET | 1B 13 | Dry etching | Primaxx | MEMS-CET | Microelectronic Systems |
|
View
| HMDS Desiccator | 2F08 21 | Lithography | nn | nn | Aalto Nanofab |
|
View
| Hot Plate | 2S11 06 | Lithography | NN | NN | Aalto Nanofab |
|
View
| Hot plate - Tmax 250C | 2L4197 02 | Characterization | Stuart | SB-500 | Electron Physics Group |
|
View
| Hot plate - Tmax 250C | 2L4196 07 | Characterization | Stuart | SB-500 | Electron Physics Group |
|
View
| Hot plate - Tmax 350C | 2L4196 08 | Characterization | IKA | C-MAG HS10 | Electron Physics Group |
|
View
| Hot plate BLE | 1F03 18 | Lithography | BLE | BLE | Microelectronic Systems |
|
View
| Hot plate duo | 1A 29B | Lithography | Sawatec | HP-200 | VTT Nanofabrication Centre |
|
View
| Hot Plate Matti | 2L1019 15 | Lithography | Präzitherm | Hot plate | Aalto Nanofab |
|
View
| Hot Plate Mervi | 2F08 20 | Lithography | UniTemp GmbH | HP-220 | Aalto Nanofab |
|
View
| Hot Plate Pia | 2F08 19 | Annealing | UniTemp GmbH | HP-220 | Aalto Nanofab |
|
View
| Hotplate OPTIHOT HB20 | 1G 09 | Lithography | ATM | OPTIhot HB20 | Microelectronic Systems |
|
View
| Hotplate Polos 200S | 2F03 12 | Lithography | SPS | Polos 200S | Aalto Nanofab |
|
View
| Hotplate Präzitherm | 2F03 14 | Lithography | Harry Gestigkeit GmbH | PZ28-2 | Aalto Nanofab |
|
View
| Hotplate Präzitherm II | 2F03 15 | Lithography | Harry Gestigkeit GmbH | PZ28-2 | Aalto Nanofab |
|
View
| IBE Scia Mill 200 | 3F11 20 | Dry etching | Scia Systems | Mill 200 | Kyocera-Tikitin |
|
View
| ICP-RIE Estrelas 100 | 2F10 17 | Dry etching | Oxford Instruments | PlasmaPro 100 Estrelas | Aalto Nanofab |
|
View
| ICP-RIE Plasmalab 100 | 2F09 12 | Dry etching | Oxford Instruments | Oxford Instruments Plasmalab System100 - ICP 180 | Aalto Nanofab |
|
View
| Impedance Analyzer | 1F13B 07 | Characterization | Agilent | 4294A | Microelectronic Systems |
|
View
| In plating module | 1F05 04 | Electrochemical Deposition | PM Plast | In | Microelectronic Systems |
|
View
| Ion Beam Trimmer | 1F08 30 | Dry etching | AMSystems | D0213 | Microelectronic Systems |
|
View
| Ion implanter Eaton 8200 | 1ST 08 | Ion Implantation | Eaton | NV8200 | Microelectronic Systems |
|
View
| IR-Inspector | 1F01 10 | Characterization | Schott Moritex | - | Microelectronic Systems |
|
View
| KOH setup | 2L1019 08 | Wet Processes | NN | NN | Microfabrication Group |
|
View
| Laser marking station Trumpf | 1OC 02 | Other processes | Trumpf | TruMark Station 5000 | VTT Nanofabrication Centre |
|
View
| Laser Micromachining System | 2L1020 07 | Other processes | Azpect / Newport | na | Aalto Nanofab |
|
View
| Laser Wafer Marker | 2L1020 12 | Other processes | Cencorp | 300 LM | Electron Physics Group |
|
View
| Laserwriter | 2F08 03 | Lithography | Microtech | LW 405 | Aalto Nanofab |
|
View
| Leak Detector | 2SF 02 | Other processes | NN | NN | Aalto Nanofab |
|
View
| Leak Detector Edwards | 2OC 06 | Other processes | Edwards | ELD 500 FLEX | Aalto Nanofab |
|
View
| Leica DM6 Optical Microscope | 2L4168 04 | Characterization | Leica | DM6 | Optoelectronics Group |
|
View
| Lifetime Scanner PV-2000 | 2F13 11 | Characterization | Semilab | PV-2000A | Electron Physics Group |
|
View
| Linear Corona Charger | 2F13 16 | Characterization | Semilab | LCC-300 | Electron Physics Group |
|
View
| Logitech PM6 Lapping system | 2L1019 42 | Other processes | Logitech | PM6 | Electronics Integration and Reliability |
|
View
| LPCVD LTO PSG Expertech | 1D 25 | CVD & ALD | Expertech | CTR200 | Advanced Manufacturing and Materials (AM2) |
|
View
| LPCVD PolySi | 2F07 04C | CVD & ALD | Centrotherm | Centrotherm | Aalto Nanofab |
|
View
| LPCVD SiN | 2F07 04B | CVD & ALD | Centrotherm | Centrotherm | Aalto Nanofab |
|
View
| Manual prober | 1F13B 05 | Characterization | Rucker & Kolls | . | Microelectronic Systems |
|
View
| Manual Prober SÜSS MicroTec PM5 | 1L4107 02 | Characterization | SÜSS MicroTec | PM5 | BA62 |
|
View
| Manual spinner apogee | 1G 33 | Back-end Processes | Apogee | Apogee | Microsystems and nanoelectronics |
|
View
| Manual Spinner Duo | 1A 29A | Lithography | Sawatec | SM-200 | VTT Nanofabrication Centre |
|
View
| Manual spinner LARGE | 1G 10 | Lithography | Headway | CB15 | Microelectronic Systems |
|
View
| Manual spinner LSM200 | 1A 12 | Lithography | Sawatec | LSM 200 | Microelectronic Systems |
|
View
| Manual spinner SCS | 1F03 17 | Lithography | SCS | SCS | Microelectronic Systems |
|
View
| Manual wafer taper | 1G 27 | Back-end Processes | SEC | 3250 | VTT Nanofabrication Centre |
|
View
| Manual Wafer Taper | 1MP 21 | Back-end Processes | SEC | 3150 | VTT Nanofabrication Centre |
|
View
| Mapping sheet resistance tool | 1F01 11 | Characterization | Advanced Instrument Technology | CMT-SR2000N | Microelectronic Systems |
|
View
| Mask aligner - Mauri Antero | 2F08 01 | Lithography | Süss | MA-6 | Aalto Nanofab |
|
View
| Mask aligner MA150 | 1A 02 | Lithography | Süss MicroTec | MA 150 | Microelectronic Systems |
|
View
| Mask Aligner MA200 | 1G 18 | Lithography | Suss MicroTec | MA 200 | Microelectronic Systems |
|
View
| Mask Aligner MA6 | 1G 17 | Lithography | Suss MicroTec | MA 6 | Microelectronic Systems |
|
View
| Mask aligner OAI 6008 | 1A 32 | Lithography | OAI | 6008 | VTT Nanofabrication Centre |
|
View
| Mask Inspection Station | 1OC 01 | Characterization | The MM Microscope Co Inc. | MIS | Microelectronic Systems |
|
View
| Maskless Aligner MLA150 | 2F08 30 | Lithography | Heidelberg | MLA150 | Aalto Nanofab |
|
View
| Metal etcher LAM TCP9600 | 1B 05 | Dry etching | LAM/Point 35 | TCP 9600 | Microelectronic Systems |
|
View
| Metal etcher SI 500 | 1F10 07-1 | Dry etching | Sentech | SI 500 | Advanced Manufacturing and Materials (AM2) |
|
View
| Micro-Raman | 2F13 08 | Characterization | WITec | WITec alpha300 RA+ | Nanotechnology Group |
|
View
| Microscope 1 | 1A 23 | Characterization | Nikon | Eclipse L200 | Microelectronic Systems |
|
View
| Microscope 11 | 1MP 06 | Characterization | Leica AG | WILD MZ8 | Microelectronic Systems |
|
View
| Microscope 12 | 1MP 11 | Characterization | Leitz | . | Microelectronic Systems |
|
View
| Microscope 13 | 1C 23 | Characterization | Nikon | Eclipse L200N | Microelectronic Systems |
|
View
| Microscope 15 | 1B 08 | Characterization | Nikon | Eclipse L200 | Microelectronic Systems |
|
View
| Microscope 16 | 1A 27 | Characterization | Nikon | Eclipse L200N | VTT Nanofabrication Centre |
|
View
| Microscope 2 | 1A 34 | Characterization | Nikon | Eclipse L200 | Microelectronic Systems |
|
View
| Microscope 4 | 1G 20 | Characterization | Nikon | Eclipse L200N | Microelectronic Systems |
|
View
| Microscope 5 | 1F02 08 | Characterization | Leitz | Secolux | Microelectronic Systems |
|
View
| Microscope 7 | 1F04 07 | Characterization | Unknown | Unknown | Microelectronic Systems |
|
View
| Microscope 9 | 1F05 15 | Characterization | Nikon | Eclipse L200 | Microelectronic Systems |
|
View
| Microscope A | 2F08 02 | Characterization | Leitz | Leitz | Aalto Nanofab |
|
View
| Microscope DIC | 1ST 01 | Characterization | DIC | - | Microelectronic Systems |
|
View
| Microscope Eclipse L200ND | 1F01 12 | Characterization | Nikon | Eclipse L200ND | VTT Nanofabrication Centre |
|
View
| Microscope F13B | 2F13 13 | Characterization | Olympus | BX60 | Aalto Nanofab |
|
View
| Microscope Opton | 2L1019 18 | Characterization | OPTON | NN | Aalto Nanofab |
|
View
| Microscope with camera | 2F10 12 | Characterization | Opton | NN | Aalto Nanofab |
|
View
| Microscope Zeiss | 2L1020 08 | Characterization | ZEISS | NN | Aalto Nanofab |
|
View
| Microscope Zeiss Axiotron | 1F13B 02 | Characterization | Zeiss | Axiotron II | Microelectronic Systems |
|
View
| Microwave asher Aura1000 | 1B 11 | Other processes | GaSonics | Aura 1000 | Microelectronic Systems |
|
View
| MOVPE I / Asterix | 2L1018 01 | Epitaxial Growth | Thomas Swan | ? | Optoelectronics Group |
|
View
| MOVPE II | 2L1018 02 | Epitaxial Growth | Thomas Swan | 3x2" CSS | Optoelectronics Group |
|
View
| MOVPE III | 2L1018 03 | Epitaxial Growth | NN | NN | Optoelectronics Group |
|
View
| mPCD scanner | 2L4196 01 | Characterization | Semilab | WT-85 | Electron Physics Group |
|
View
| Needle corona charger | 2L4196 04 | Characterization | KG | KG 201 | Electron Physics Group |
|
View
| Non destructive X-Ray inspection | 2L4142 11 | Characterization | FEIN FOCUS | FXS-160.24 | Electronic reliability and integration |
|
View
| Non-contact sheet resistivity tool | 1F04 10 | Characterization | Suragus | EddyCus | Microelectronic Systems |
|
View
| OEM Sputtering System | 1E 03 | Sputtering | OEM | Mark Eclipse IV | Microelectronic Systems |
|
View
| Olympus MX63L 200mm wafer inspection microscope | 2F10 18 | Characterization | Olympus | MX63L | Aalto Nanofab |
|
View
| Optical Profilometer Contour | 1F01 05 | Characterization | Bruker | GTX | Microelectronic Systems |
|
View
| Optical Profilometer Filmetrics | 2L1020 09 | Characterization | Filmetrics | Profilm3D | Aalto Nanofab |
|
View
| Optical transmission analyzer | 1F06 14 | Characterization | VTT | Two | VTT Nanofabrication Centre |
|
View
| Oven 120 | 2F08 13 | Lithography | Memmert | Memmert | Aalto Nanofab |
|
View
| Oven 90 | 2F08 14 | Lithography | Memmert | Memmert | Aalto Nanofab |
|
View
| Oven Adjustable | 2F08 12 | Lithography | Memmert | Memmert | Aalto Nanofab |
|
View
| Oven Despatch | 1G 02 | Annealing | Despatch Industries | LCC/D1-51N-3 | Microelectronic Systems |
|
View
| Oven Memmert | 2L1019 12 | Annealing | Memmert | nn | Aalto Nanofab |
|
View
| Oven2 | 1MP 08 | Annealing | Memmert | . | Microelectronic Systems |
|
View
| Oven3 | 1MP 09 | Annealing | Poweta | . | Microelectronic Systems |
|
View
| Oxidation 1 | 2F07 01A | Furnace Processes | Centrotherm | Centrotherm | Aalto Nanofab |
|
View
| Oxidation 2 | 2F07 01B | Furnace Processes | Centrotherm | Centrotherm | Aalto Nanofab |
|
View
| Oxidation 3 | 2F07 01C | Furnace Processes | Centrotherm | Centrotherm | Aalto Nanofab |
|
View
| Oxidation 4 | 2F07 01D | Furnace Processes | Centrotherm | Centrotherm | Aalto Nanofab |
|
View
| Oxidation furnace PEO-603 | 1E 20 | Furnace Processes | ATV | PEO-603 | Microelectronic Systems |
|
View
| Oxide etcher LAM4520 | 1B 03 | Dry etching | LAM/Point 35 | LAM 4520 | Microelectronic Systems |
|
View
| Oxide Etcher LAM4520XL | 1B 20 | Dry etching | LAM | 4520 XL | VTT Nanofabrication Centre |
|
View
| Oxide etcher SI 500 | 1F10 07-2 | Dry etching | Sentech | SI 500 | Advanced Manufacturing and Materials (AM2) |
|
View
| Oxide ICP etcher STS AOE | 1F10 03 | Dry etching | STS | AOE | Microelectronic Systems |
|
View
| Parylene spray deposition tool | 1H06 04 | Other processes | SCS Coating | PSD 2010 Labcoater2 | Microelectronic Systems |
|
View
| PECVD Oxford Plasmalab100 | 1F04 11 | CVD & ALD | Oxford | Plasmalab100 | Microelectronic Systems |
|
View
| PECVD Oxford PlasmaPro System 100 | 1B 18 | CVD & ALD | Oxford | Plasmapro System 100 | Microelectronic Systems |
|
View
| PECVD Plasmalab F10 | 2F10 07 | CVD & ALD | Oxford Instruments | Plasmalab 80Plus Oxford Instruments | Aalto Nanofab |
|
View
| Plasma stripper 1 PRS801 | 1B 10 | Other processes | Plasma Technology | PRS 801 | Microelectronic Systems |
|
View
| Plasma stripper PRS900 | 1F10 06 | Other processes | Oxford Instruments | PRS900 | Microelectronic Systems |
|
View
| Plasma Stripper Q240 | 1G 34 | Dry etching | Alpha Plasma | Q240 | Microsystems and nanoelectronics |
|
View
| Plasma stripper TePla 380P | 1B 23 | Other processes | PVA TePla | Plasma System GIGAbatch 380P | VTT Nanofabrication Centre |
|
View
| Plating work bench | 1F05 28 | Electrochemical Deposition | Plast Service | Plast Service | Microelectronic Systems |
|
View
| Polos Hotplate 200S | 1G 32 | Lithography | Polos | S200 | VTT Nanofabrication Centre |
|
View
| Polysilicon etcher LAM4420 | 1B 04 | Dry etching | LAM/Point 35 | LAM 4420 | Microelectronic Systems |
|
View
| Precision tester | 2L1151/1 01 | Characterization | - | - | Electronics Integration and Reliability |
|
View
| Prime Oven HMDS | 2F08 24 | Lithography | YES | YES-3 | Aalto Nanofab |
|
View
| Primer oven YES-5 | 1G 14 | Lithography | Yield Engineering | YES-5 | Microelectronic Systems |
|
View
| Primer oven YES-58TAE | 1A 31 | Lithography | Yield Engineering Systems | 58TAE | VTT Nanofabrication Centre |
|
View
| Probe station Cascade | 1F13B 04 | Characterization | Cascade Microtech | Model 12000 | Microelectronic Systems |
|
View
| Probe Station MPI TS3000-SE | 1F13B 03 | Characterization | MPI Corporation | TS3000-SE | VTT Nanofabrication Centre |
|
View
| Probe Station Semiprobe | 1F13 06 | Characterization | Semiprobe | SA-8VP | VTT Nanofabrication Centre |
|
View
| Probe System MPI TS2000-D | 1L4107 01 | Characterization | MPI Corporation | TS2000-D | Microelectronic Systems |
|
View
| Probestation | 2L4142 03 | Back-end Processes | Süss | ? | Organic Electronics |
|
View
| Profilometer Bruker DektakXT | 1E 19 | Characterization | Bruker | DektakXT | VTT Nanofabrication Centre |
|
View
| Profilometer Dektak/XT | 2F10 14 | Characterization | Bruker | Dektak/XT | Aalto Nanofab |
|
View
| Profilometer Veeco Dektak M6 | 1E 14 | Characterization | Veeco | Dektak M6 | Microelectronic Systems |
|
View
| PVD system Angstrom | 2L1019 43 | Evaporation | Angstrom Engineering | 09340 | Aalto Nanofab |
|
View
| QuickSun | 2L4142 12 | Characterization | Endeas | 120CA | Electron Physics Group |
|
View
| RCA 2 | 2F11 16 | Wet Processes | PM Plast | NN | Aalto Nanofab |
|
View
| Reflectometer 2000M-NIR | 1B 21 | Characterization | SCI | 2000M-NIR | VTT Nanofabrication Centre |
|
View
| Reflectometer F50-UV System | 1ST 16 | Characterization | Filmetrics | F50-UV | BA62 |
|
View
| Reflectometer FilmTek 2000M | 1E 24 | Characterization | Scientific Computing Int. | FilmTek 2000M | Microelectronic Systems |
|
View
| Reflectometer Opton | 2F13 19 | Characterization | OPTON | OPTON Axiospeed | Aalto Nanofab |
|
View
| Reflow oven ATV | 1F05 01 | Annealing | ATV | SRO_704_R | Microelectronic Systems |
|
View
| Rena Cu plating A | 1F05 24 | Electrochemical Deposition | RENA | . | Microelectronic Systems |
|
View
| Rena Ni plating | 1F05 26 | Electrochemical Deposition | RENA | . | Microelectronic Systems |
|
View
| RENA Sn plating | 1F05 25 | Electrochemical Deposition | RENA | . | Microelectronic Systems |
|
View
| Rena SnPb plating | 1F05 27 | Electrochemical Deposition | RENA | . | Microelectronic Systems |
|
View
| Resist oven 1 | 1A 13 | Lithography | Memmert | UFE400 | Microelectronic Systems |
|
View
| Resist oven 3 | 1A 15 | Lithography | Memmert | UFE400 | Microelectronic Systems |
|
View
| Resist oven LOWER (5) | 1G 16 | Lithography | Memmert | UFE 400 | Microelectronic Systems |
|
View
| Resist oven UPPER (4) | 1G 15 | Lithography | Memmert | UFE 400 | Microelectronic Systems |
|
View
| Resist Spinner LabSpin | 2F08 29 | Lithography | Süss | LabSpin6 | Aalto Nanofab |
|
View
| Resist Spinner LabSpin8 | 2F08 31 | Lithography | SUSS MicroTec Lithography GmbH | LABSPIN8 | Aalto Nanofab |
|
View
| Resist Spinner LabSpin8 EBL | 2F03 10 | Lithography | Süss | LabSpin 8 | Aalto Nanofab |
|
View
| Resist Station Gamma4 | 1G 07 | Lithography | Suss MicroTec | Gamma 4 | Microelectronic Systems |
|
View
| RIE Oxford 80Plus | 1F04 08 | Dry etching | Oxford | 80 PLUS RIE | Microelectronic Systems |
|
View
| RIE Plasmalab F10 | 2F10 05 | Dry etching | Oxford Instruments | Plasmalab 80Plus Oxford Instruments | Aalto Nanofab |
|
View
| Rinse Dryer 4-6 | 2F08 22 | Other processes | Semitool | 870S | Aalto Nanofab |
|
View
| Rinse Dryer 4-6 | 2F07 10 | Other processes | Semitool | 870S | Aalto Nanofab |
|
View
| Rinse Dryer Semitool 100 | 2F12 25 | Wet Processes | Semitool | 2 stock | Aalto Nanofab |
|
View
| Rinse Dryer Semitool 150 | 2F12 24 | Wet Processes | Semitool | nn | Aalto Nanofab |
|
View
| Rinse Dryer Square | 2F07 11 | Other processes | Semitool | 870S | Aalto Nanofab |
|
View
| Rinse Dryer Square | 2F08 23 | Other processes | Semitool | 870S | Aalto Nanofab |
|
View
| Rinse Dryer Verteq 100 | 2F11 15 | Wet Processes | Verteq | nn | Aalto Nanofab |
|
View
| Rinse Dryer Verteq 150 | 2F11 14 | Wet Processes | Verteq | 2 stock | Aalto Nanofab |
|
View
| RTA | 2L1020 01 | Annealing | Russia | Foton-6 | Aalto Nanofab |
|
View
| RTA JetFirst 300C | 1E 23 | Furnace Processes | EMC technologies | JetFirst 300C | Microsystems and nanoelectronics |
|
View
| RTP Jipelec | 2F12 09 | Annealing | Jipelec | Jipelec | Aalto Nanofab |
|
View
| SAM Acoustic microscope | 1E 07 | Characterization | Sonix | HS3000 | Microelectronic Systems |
|
View
| SEM Crossbeam 550L | 1A 30 | Characterization | Zeiss | Crossbeam 550L | Advanced Manufacturing and Materials (AM2) |
|
View
| SEM EBL Zeiss Supra 40 | 2F13 07 | Characterization | Zeiss | Zeiss Supra 40 | Aalto Nanofab |
|
View
| SEM Leo 1560 | 1F13 21 | Characterization | Zeiss | LEO1560 | Microelectronic Systems |
|
View
| SEM Supra 35 | 1TF 07 | Characterization | Zeiss | Supra 35 | Microelectronic Systems |
|
View
| SEM Tabletop | 2L4168 05 | Characterization | Hitachi | Hitachi TM-1000 | Aalto Nanofab |
|
View
| Semiconductor Parameter Analyzer | 1F06 08 | Characterization | Agilent | 4155C | Microelectronic Systems |
|
View
| Silicon ICP etcher (Aviza) | 1F10 08 | Dry etching | Aviza | Omega i2l | Microelectronic Systems |
|
View
| Silicon ICP etcher (STS) | 1F10 02 | Dry etching | STS | ASE | Microelectronic Systems |
|
View
| Sink Neutralization | 2F08 25 | Wet Processes | PM Plast | X | Aalto Nanofab |
|
View
| Sink Solvent | 2F08 26 | Wet Processes | PM Plast | X | Aalto Nanofab |
|
View
| Sinton Lifetime | 2F13 17 | Characterization | Sinton Instruments | WCT-120 & Suns-Voc | Electron Physics Group |
|
View
| SIRM | 2L1019 39 | Characterization | NN | NN | Electron Physics Group |
|
View
| Small LED lamp | 2L4196 09 | Characterization | - | - | Electron Physics Group |
|
View
| SnAg plating module | 1F05 09 | Electrochemical Deposition | PM Plast | . | Microelectronic Systems |
|
View
| SNOM/NSOM WITec alpha300 | 2L4166 01 SNOM | Characterization | WITec | alpha 300 | Micro and Quantum Systems |
|
View
| Spectrophotometer Filmetrics | 2EC 10 | Characterization | Filmetrics | F10-RT-UVX | Nanotechnology Group |
|
View
| Spectroscopic ellipsometer SE2000 | 1F01 09 | Characterization | Semilab | SE2000 | VTT Nanofabrication Centre |
|
View
| Spectroscopic Ellipsometer SE-2000 | 2F09 05 | Characterization | Semilab | SE-2000 | Aalto Nanofab |
|
View
| Spin Etcher | 1ST 10 | Wet Processes | Optiwet | SB30 | Microelectronic Systems |
|
View
| Spin rinse drier 1 (150 mm) | 1A 19 | Wet Processes | Verteq | Superclean 1600-44 | Microelectronic Systems |
|
View
| Spin Rinse Drier 18 (150 mm) | 1ST 06 | Wet Processes | Semitool | SRD 880S | Microelectronic Systems |
|
View
| Spin rinse drier 2 (150 mm) | 1A 20 | Wet Processes | Verteq | Superclean 1600-34 | Microelectronic Systems |
|
View
| Spin Rinse Drier 20 | 1G 04 | Wet Processes | Verteq | Superclean 1600-34 | Microelectronic Systems |
|
View
| Spin rinse drier 5 (100 mm) | 1C 12 | Wet Processes | Verteq | Superclean 1600-34 | Microelectronic Systems |
|
View
| Spin Rinse Dryer 20 and 21 (150/200mm) | 1F02 09 | Wet Processes | MTEK | 270/2300 | VTT Nanofabrication Centre |
|
View
| Spin/Rinse Dryer 11 (100 mm) | 1F02 03 | Wet Processes | Verteq | Superclean 1600/55M | Microelectronic Systems |
|
View
| Spinner 8 inch | 1F05 21 | Wet Processes | Laurell | EDC1-100-8NPP/IND | Microelectronic Systems |
|
View
| Spinner Convac | 2S11 03 | Lithography | Convac | NN | Aalto Nanofab |
|
View
| Spinner Cu | 2F11 17 | Wet Processes | Laurell | NN | Electron Physics Group |
|
View
| Spinner I | 2F03 11 | Lithography | Laurell | NN | Aalto Nanofab |
|
View
| Spinner Laurell | 2S11 05 | Lithography | Laurell | NN | Aalto Nanofab |
|
View
| Spinner Lithography | 2L1019 38 | Lithography | Laurell | NN | Microfabrication Group |
|
View
| Sputter Chromium | 2L1019 28 | Sputtering | Emitech | K575X | Electronic reliability and integration |
|
View
| Sputter Gold | 2L1019 19 | Sputtering | OPTON | OPTON | Aalto Nanofab |
|
View
| Sputter Plasmalab F10 | 2F10 04 | Sputtering | Oxford Instruments | Plasmalab 400, Oxford Instruments | Aalto Nanofab |
|
View
| Sputtering system Mark IV | 1F04 01 | Sputtering | TEL | Mark Eclipse IV | Microelectronic Systems |
|
View
| Sputtering system 1 PV-LLS801 | 1E 01 | Sputtering | Provac | PV-LLS801 | Microelectronic Systems |
|
View
| Sputtering system CLN 200 | 1F04 12 | Sputtering | Evatec | CLN 200 | VTT Nanofabrication Centre |
|
View
| Sputtering system MRC | 1F04 09 | Sputtering | MRC | 903 | Microelectronic Systems |
|
View
| Sputtering system VA | 1F04 04 | Sputtering | VonArdenne | CS 730 S Cluster System | Microelectronic Systems |
|
View
| SPV Scanner | 2L4142 05 | Characterization | Semilab | WT85XL-400 | Electron Physics Group |
|
View
| Stereo Microscope F10B | 2F10 09 | Characterization | nn | nn | Aalto Nanofab |
|
View
| Struers Grinding LaboPol-21 | 2L1177A 02 | Back-end Processes | Struers | LaboPol-21 | Electronic reliability and integration |
|
View
| Struers Polishing Tegramin-25 | 2L1177A 01 | Back-end Processes | Struers | Tegramin-25 | Electronic reliability and integration |
|
View
| Suns-Voc | 2L4196 10 | Characterization | Sinton | VOC-0246 | Electron Physics Group |
|
View
| Suntest XLS | 2L4142 08 | Characterization | Atlas Material Testing Solutions | Suntest XLS+ | Electron Physics Group |
|
View
| Tape Press | 1MP 14 | Back-end Processes | A | B | BA62 |
|
View
| Temperature dependent Sinton Lifetime | 2L4196 03 | Characterization | Sinton Instruments | WCT-120TS | Electron Physics Group |
|
View
| TePla 400 | 2L1019 20 | Other processes | PVA TEPLA | 400 Plasma System | Electronics Integration and Reliability |
|
View
| Test_tool_Mko | XXXXXXXX | Nanostructuring | Random | Random | Physical Characteristics of Surfaces and Interface |
|
View
| TMAH etch | 2F12 11 | Wet Processes | NN | NN | Aalto Nanofab |
|
View
| Ultrasonic Bath | 2F12 04 | Wet Processes | nn | nn | Aalto Nanofab |
|
View
| UV Lamp System | 2L1019 16 | Characterization | DYMAX | ECE 2000 | Microfabrication Group |
|
View
| UV photostabilizer | 1A 33 | Lithography | Fusion | M150PC | Microelectronic Systems |
|
View
| UV-Lamp Visual Inspection | 2F09 10 | Other processes | nn | nn | Aalto Nanofab |
|
View
| UV-NIL (accessory for Mauri Antero) | 2F08 01B | Lithography | Suss | Suss MA-6 | Aalto Nanofab |
|
View
| Vacuum Furnace Webb | 2L1019 21 | Annealing | Webb | Red Devil M | Electronics Integration and Reliability |
|
View
| Vacuum Oven | 1G 13 | Lithography | Heraus | Oven | Microelectronic Systems |
|
View
| Vacuum Oven | 1B 22 | Annealing | Goldbrunn | 1450 | VTT Nanofabrication Centre |
|
View
| Wafer backgrinder 7AF | 1ST 02 | Back-end Processes | Strasbaugh | 7AF | Microelectronic Systems |
|
View
| Wafer Bonder AML | 2F11 08 | Wafer Bonding | AML | AML-AWB, year 2008 | Aalto Nanofab |
|
View
| Wafer Bonder EVG 510 | 1G 35 | Wafer Bonding | EVG | EVG 510 | Microelectronic Systems |
|
View
| Wafer bonder EVG5201S | 1E 16 | Wafer Bonding | Electronic Vision | EVG5201S | Microelectronic Systems |
|
View
| Wafer Cleaner Batchspray Acid | 1C 24 | Wet Processes | Siconnex | Batchspray acid 2.0 | VTT Nanofabrication Centre |
|
View
| Wafer Defect Inspection System | 1E 21 | Characterization | NanoPhotonics | Reflex TT | Microelectronic Systems |
|
View
| Wafer loader NWL 1 | 1A 28 | Characterization | Nikon | NWL200 | Advanced Manufacturing and Materials (AM2) |
|
View
| Wafer spinner POLOS | 1G 22 | Lithography | SPS | MCD200 NPP | Microelectronic Systems |
|
View
| Wafer Stepper FPA 3000-i4 | 1A 04 | Lithography | Canon | FPA 3000-i4 | Microelectronic Systems |
|
View
| Vector Network Analyzer | 1F13B 06 | Characterization | Anritsu | . | Microelectronic Systems |
|
View
| Wet Bench F11A | 2F11 06 | Wet Processes | Stangl | Stangl | Aalto Nanofab |
|
View
| Wet Bench MIXED ETCHANTS | 1F02 04 | Wet Processes | Stangl | ME | Microelectronic Systems |
|
View
| Wet Bench PRE-CLEAN | 2F12 06 | Wet Processes | PMPlast | old VTT wet bench | Aalto Nanofab |
|
View
| Wet Bench RCA 1-2 | 2F07 08 | Wet Processes | Stangl | Acid | Aalto Nanofab |
|
View
| Wet bench D CLEAN 1 | 1D 07 | Wet Processes | Stangl | Stangl07 | Microelectronic Systems |
|
View
| Wet bench D CLEAN 2 | 1D 09 | Wet Processes | Stangl | Stangl | Microelectronic Systems |
|
View
| Wet Bench DCLEAN 3 | 1D 10 | Wet Processes | Stangl Singulus | - | Microelectronic Systems |
|
View
| Wet bench DEVELOP 2 | 1G 23 | Wet Processes | Stangl | WB | Microelectronic Systems |
|
View
| Wet Bench Development | 2F08 10A | Wet Processes | Stangl | Acid | Aalto Nanofab |
|
View
| Wet bench HF 1 | 1C 04 | Wet Processes | Stangl | Stangl | Microelectronic Systems |
|
View
| Wet bench HF 2 | 1C 05 | Wet Processes | Stangl | Stangl | Microelectronic Systems |
|
View
| Wet bench Hot plates | 2F08 18 | Lithography | PMPlast | PMPlast | Aalto Nanofab |
|
View
| Wet Bench KOH | 2L1020 11 | Wet Processes | Plade | NN | Aalto Nanofab |
|
View
| Wet Bench MASK CLEAN | 1G 26 | Wet Processes | Stangl | Mask Clean | Microelectronic Systems |
|
View
| Wet bench METAL ETCH | 1C 08 | Wet Processes | Stangl | Stangl | Microelectronic Systems |
|
View
| Wet Bench Oxide Etch | 2F08 10B | Wet Processes | Stangl | nn | Aalto Nanofab |
|
View
| Wet bench Piranha | 2F08 10C | Wet Processes | Stangl | NA | Aalto Nanofab |
|
View
| Wet bench PIRANHA | 1C 16 | Wet Processes | Stangl | Stangl | Microelectronic Systems |
|
View
| Wet Bench POLYMERS | 1F05 31 | Wet Processes | Stangl | Polymers | Microelectronic Systems |
|
View
| Wet bench POSISTRIP 1 | 1C 10 | Wet Processes | Stangl | Stangl | Microelectronic Systems |
|
View
| Wet bench POSISTRIP 2 | 1C 11 | Wet Processes | Stangl | Stangl | Microelectronic Systems |
|
View
| Wet bench POST CMP | 1ST 05 | Wet Processes | SSE/Arias | . | Microelectronic Systems |
|
View
| Wet bench Resist Removal | 2F08 09 | Wet Processes | Stangl | Solvent | Aalto Nanofab |
|
View
| Wet bench RINSE | 1D 08 | Wet Processes | Plast Service | Rinse module | Microelectronic Systems |
|
View
| Wet Bench Rinse | 2F12 27 | Wet Processes | Stangl | NN | Aalto Nanofab |
|
View
| Wet bench RINSE 1 | 1F02 06 | Wet Processes | Stangl | RINSE | Microelectronic Systems |
|
View
| Wet bench SOLVENTS | 1A 22 | Wet Processes | Stangl | - | Microelectronic Systems |
|
View
| Wet Bench spinner | 2F08 16 | Lithography | Stangl | Wet Bench with Spinner | Aalto Nanofab |
|
View
| Wet bench STANDARD ETCHANTS | 1F02 02 | Wet Processes | Stangl | SE | Microelectronic Systems |
|
View
| Vibrometer Lynceetec | 1F13B 09 | Characterization | Lyncee Tec | DHM | Physical Characteristics of Surfaces and Interface |
|
View
| Wire Bonder Bondtec 5330 | 2L4142 13 | Back-end Processes | FS bondtec | 5330 | Aalto Nanofab |
|
View
| Wire bonder Delvotec 53 | 2L4142 01 | Back-end Processes | Delvotec 53 | Delvotec 53BDA | Aalto Nanofab |
|
View
| Wire Bonder Delvotec 53XX | 2L4142 09 | Back-end Processes | Delvotec | 53XX | Aalto Nanofab |
|
View
| XeF2 Etcher | 1E 18 | Dry etching | SPTS | Xactix | Microelectronic Systems |
|
View
| Xenon lamp | 2L4196 06 | Characterization | Micronova | - | Electron Physics Group |
|
View
| XRD Panalytical | 2L4168 02 | Characterization | Panalytical | NN | Nanotechnology Group |