Sputter deposition by physical vapor deposition (PVD) of Al, Cu, Cr, Ti, Pt, W.
Water cooled substrate holder, deposition in rotating or static mode, vacuum loadlock for one wafer.
Only 100 mm
Si, SiO2, Si3N4, metals, photoresists, semiconductors and glasses (ask main user).
Sticky, powder and liquid materials.
License and training!!!
The tool training is given on the 4-th Tuesday of every month, at 10:00. Contact a main user to confirm your participation.