Sputter deposition by physical vapor deposition (PVD) of Al, Cu, Cr, Ti, Pt, W.

Key Features and Accessories:

Water cooled substrate holder, deposition in rotating or static mode, vacuum loadlock for one wafer.

Substrate Size:

Only 100 mm

Allowed Materials:

Si, SiO2, Si3N4, metals, photoresists, semiconductors and glasses (ask main user).

Forbidden Materials:

Sticky, powder and liquid materials.