Picture of Mask Aligner MA6
Current status:
AVAILABLE
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Manual contact aligner with front-side and back-side alignment for up to 6” wafers. Tooling exists for 4” wafers (with 5”x5” photomasks), 6” wafers (with 7”x7” photomasks), and also for 8” wafers (with 9”x9” photomasks), but the exposed area is limited to a circle with a diameter of 165 mm). Tooling also exists for exposing discrete chips with 4”x4” photomasks. 5” wafers have been exposed with 6” hardware. Nominal resolution (with vacuum contact) is 0.6 µm. The tool is classification depends on the chuck type: there is one chuck for IC clean wafers and the other for Non IC.

Tool name:
Mask Aligner MA6
Area/room:
M2 G Lithography and BCB
Category:
Lithography
Manufacturer:
Suss MicroTec
Model:
MA 6

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