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SnAg electroplating system for plating of solder or bonding material. A high-purity electroplating process which produces fine-grained, matte, pure tin deposits. It is especially formulated for use in the fabrication of circuit patterns and bumps on semiconductor wafers.

Tool name:
SnAg plating module
Area/room:
M2 F5 Plating
Category:
Electrochemical Deposition
Manufacturer:
PM Plast
Model:
.

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