Picture of Fume Hood Electroplating
Current status:
DOWN
Book | Log
Show/Collapse all

You must be logged in to view files.

Use: Electroplating of Cu, Sn and Ni

Allowed seed - layer metallization : Cu, Au, Pt & Pd 


 
 

Tool name:
Fume Hood Electroplating
Area/room:
Lab 1019 Thin Film
Category:
Wet Processes
Manufacturer:
NB Technologies
Model:
NN

Allowed seed-layer metallization: Cu, Au, Pt & Pd.

Instructors

Licensed Users

You must be logged in to view tool modes.