Picture of Hotplate IKA C-MAG
Current status:
AVAILABLE
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Hot plate for operations with Crystalbond 555: gluing of small samples or chips to a carrier wafer for further use in dry etching tools; ungluing of samples from the carrier wafer.

Temperature setpoint at the hotplate: 75C; fixed.
For wafer diameter: max. 200 mm / 8".

Tool name:
Hotplate IKA C-MAG
Area/room:
M2 F9 ALD
Category:
Wet Processes
Manufacturer:
IKA
Model:
C-MAG HP 10

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