Description:

The tool is designed for alignment of wafers prior to bonding in EVG 520 wafer bonder. Also tooling for mechanical mask alignment.

Key Features and Accessories:

Optical alignment mark locations: X = ± 40 mm from wafer centre Y = 0 mm from centreline (contact engineer in charge for details).

Key Specifications:

Alignment accuracy after wafer bonding < 10 µm.

Substrate Size:

100 mm and 150 mm

Allowed Materials:

IC-compatible chuck for 150 mm wafers. Non-IC compatible chucks for 150 mm and 100 mm wafers.

Forbidden Materials:

Other except allowed materials.

Availability and Cost:

Availability: O
Cost: High