Wafer Bonder EVG 510 is a tool for Metal thermocompression bonding, Eutectic bonding and Adhesive bonding of 150mm and 200mm wafers. The wafers can be compressed using high force (1kN-50kN) at temperatures between room temperature and 550C in vacuum (10^-3 mbar).

Annealing before or after bonding can be done in controlled atmosphere of nitrogen, forming gas (H2/N2 mix) or in vacuum.