RCA II cleaning for Si and Pyrex

Use a fresh solution: 7L DI water + 1.4L Hydrochloric Acid 37% (HCl) + 1.4L Hydrogen Peroxide 30% (H₂O₂)

• Process bath temperature: 80°C

• Substrate Size: 100 mm / 150 mm

• Allowed materials: Silicon wafers

• Forbidden materials: Non-silicon materials. All metals. All non-cleanroom-compatible materials