E-beam evaporator

• Load-lock for 6 wafers/samples
• Wafer size 200 mm and smaller
• Crude oxidation in load lock possible with oxygen pressure up to 200 Torr (300 Torr)

Deposition chamber

• Gridless Ion Beam Etch unit (Telemark)
• 8 pocket e-beam evaporator 10 kV / 12 kW
• Pocket size 25 cc and with liner 17.1 cc
• Pocket reducer size 7 cc and with liner 3.6 cc
• Multi Crystal rate sensor with 8 crystals

Wafer holder

• Tilt ±180°
• Rotation
• At 45° perpendicular to IBE unit

Equipment is intended for deposition of materials on superconducting devices.

MAGNETIC MATERIALS NOT ALLOWED:

• Ferromagnets (Fe, Co, Ni) 
• Antiferromagnets (Cr)
• Mn from the group of paramagnets
• Many elements of the lanthanide group (Gd, Dy, Nd)