The tool is designed for deep silicon etching based on Bosch process. Available wafer sizes are 150 mm and 200 mm. Etch rate may exceed 10 µm/min, selectivities to mask materials range from 10 to 10 000, aspect ratios reached depend on feature geometry and size. Uniformities below 5 % (or even below 2 %) can be achieved, depending on other process requirements.