Picture of Wire Bonder Bondtec 5330
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Description

Bonding wire: 25 um Al wire (Au upon request)

Allowed Materials:

Hard materials. For example copper or aluminum bonding pads

Forbidden Materials: Soft materials

 

 

Details
Tool name:
Wire Bonder Bondtec 5330
Area/room:
Lab 4142
Category:
Back-end Processes
Manufacturer:
FS bondtec
Model:
5330
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