Picture of Manual wafer taper
Current status:
AVAILABLE
Book | Log| 
Show/Collapse all

Responsibles
Files
You must be logged in to view files.
Description

~~The manual wafer taper MODEL 3250 Wafer/Backlap Applicator can be used for either dicing film or back grind film lamination.

Details
Tool name:
Manual wafer taper
Area/room:
M2 G Lithography and BCB
Category:
Back-end Processes
Manufacturer:
SEC
Model:
3250
Instructors & Licensed Users

Instructors

Licensed Users

Tool Modes
You must be logged in to view tool modes.