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Die Sorter to pick chips from a diced wafer and place them to a gel pack. Specific dies can be set to be sorted into different gel packs. Uses a vacuum picking tool.

Holds 12 gel packs, so more than 12 different dies or sorting requests need to be done in multiple stages.

Can take pictures of dies placed, but slows down the picking.

The dies need to be in a grid and arranged into reticles.

Currently has only 1 picking tool that can handle dies at least from 5 mm to 10 mm in size.

Tool name:
Die Sorter IC 1200
Micropackaging Laboratory
Other processes
IC 1200


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