Tubes in oxidation stack:
Gases N2, O2, H2, Bubbler TRANS-LC (trans 1,2-Dichloroethen).
The only allowed use of OX4 is the oxidation of blank RCA-cleaned and HF-dipped wafers i.e. the first oxidation in the process flow. Both dry and wet oxidation processes are allowed. Each research group or company can have at maximum two trained operators for the regular use of OX4.
The wafers must not have undergone any other process steps, such as lithography, etching, or additional doping, before oxidation in OX4. These kinds of wafers should be processed in OX3.