Description:

Ovens for photoresist baking during litography processes.

Key Features and Accessories:

Chamber size 400x400x330 mm. 

Key Specifications:

A12, Resist Oven 1, "soft bake", is kept permanently at 90°C. A13, Resist Oven 2, "post bake", temperature adjustable between 110-120°C. A14, Resist Oven 3, "hard bake", temperature adjustable from 140°C up to 250°C.

Substrate Size:

100 mm or 150 mm dia

Allowed Materials:

Subsrates: silicon, quartz. Layers: IC-compatible metals

Forbidden Materials:

Non IC-compatible materials

Availability and Cost:

Availability: F
Cost: Low