Picture of Bond Aligner EVG 610
Current status:
AVAILABLE
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Bond Aligner EVG 610 is a tool for aligning 150mm and 200mm wafers. The aligned wafers can be bonded with either Wafer Bonder EVG 510 or Wafer Bonder EVG 5120s.

Tool name:
Bond Aligner EVG 610
Area/room:
M2 G Lithography and BCB
Category:
Wafer Bonding
Manufacturer:
EVG
Model:
EVG 610

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