ONLY FOR 4" WAFERS!!!
Anodic and thermocompression bonding, thermal embossing See Process info
Use: • Anodic bonding • Thermocompression bonding • Thermal embossing Specifications: • Only for 100 mm wafers • Temperature range: 20 °C … 500 °C • Max anodic bonding voltage 2.5 kV • Best vacuum ~10−5 mbar • Max compression 15 kN (200 N with graphite top platen)