The Neo 200A is a single wafer plasma processing system, designed for advanced ashing, etching, cleaning and surface treatment of wafers. The fully automated downstream microwave plasma tool includes a built-in computer and touch screen graphical display, which enables on-screen access to recipes, process monitoring, and recipe editing. Oxygen and nitrogen plasma is generated within a reaction chamber, and the reactive radicals flow downstream into the process chamber, passing over the wafer. This achieves an “afterglow” state, where electrons and ions recombine, minimising electrical damage. The dissociated oxygen reacts chemically with the photoresist, effectively removing it from the wafer.

The tool is IC-compatible. B and C class wafers allowed. Please contact the tool responsible person to get training and start using the tool.